Abstract: We describe the design and packaging of a high-performance and low-loss two-port SOA-based module. Our results show gain>15 dB, NF7 dB, 11.3 dBm (single channel operation) and 18.6 dBm (WDM) ...
Abstract: The mismatch in coefficients of thermal expansion (CTE) among materials in silicon carbide (SiC) power modules during reflow soldering leads to significant warpage of the Direct Bonded ...
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