Understanding the boundary layer transition and the influence of surface roughness in hypersonic flows is critical for advancing aerospace design and safety. At these extreme speeds, the interplay ...

A panel-level (PL) approach to fan-out (FO) packaging has been discussed for several years to reduce the cost of chip-first FO packaging based on redistribution layer (RDL) technology. More recently, ...

—The development of a process flow capable of demonstrating functionality of a monolithic complementary FET (CFET) transistor architecture is complex due to the need to vertically separate nMOS and ...

In an experiment on how turbulent boundary layers respond to acceleration in the flow around them, aerospace engineers at the observed an unexpected internal boundary layer. In an experiment on how ...

Process Engineer Richard Kasica of NIST’s Center for Nanoscale Science and Technology holds a wafer of the type typically produced in the plasma-enhanced chemical vapor deposition chamber. A new study ...