The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also ...
Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...
A new technical paper titled “Harnessing Heterogeneity for Targeted Attacks on 3-D ICs” was published by Drexel University. “As 3-D integrated circuits (ICs) increasingly pervade the microelectronics ...
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