Abstract: Stacked intelligent metasurfaces (SIMs), which integrate multiple programmable metasurface layers, have recently emerged as a promising technology for advanced wave-domain signal processing.
Overview: Generative AI tools now help with writing, coding, designing, business operations, automating, and researching ...
Introducing TanStack AI: a revolutionary, framework-agnostic toolkit empowering developers with unparalleled control over their AI stack. This open-source release features a unified interface across ...
Abstract: This paper describes the architecture of the wafer-on-wafer (WOW) via-last through silicon via (TSV), named Bumpless Build Cube-TSV (BBCube-TSV). At first, the three types of TSVs, $\mu $ ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results