Abstract: The H-formulation, used abundantly for the simulation of high-temperature superconductors, has shown to be a very versatile and easily implementable way of modeling electromagnetic phenomena ...

COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...

COMSOL Multiphysics® version 6.4 introduces new and updated functionality as well as the new Granular Flow Module, based on the discrete element method (DEM), for simulating grain and powder flow. The ...

Magnetic resonance imaging (MRI) is one of the most commonly used tests in neurology and neurosurgery. MRI provides exquisite detail of brain, spinal cord and vascular anatomy, and has the advantage ...

Independent analyses have shown that Amazon gives its house brands a privileged perch. The Markup found that Amazon’s brands and exclusives (despite being a small share of the catalogue) captured the ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...

Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...

Universal or guaranteed basic income programs are gaining momentum across the country, as local governments and nonprofits experiment with the bold new alternative to traditional welfare models.

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...