With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the ...

With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as ...

Zymet’s reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work was performed in a collaborative effort between Portland State ...

Endicott, N.Y.— Endicott Interconnect Technologies has developed a semiconductor package marketed under the brand-name CoreEZ, which uses an organic, thin core build-up flip chip technology that ...

High-reliability rad hard MOSFETs undergo extensive screening and quality conformance testing to ensure that devices perform to specification in the harshest environments. For Defense Logistics Agency ...