Abstract: 3D-IC technology, it may be more appropriate to refer to this as TSV (Through-Si Via) formation technology, has been maturing year by year and is increasingly utilized in advanced ...
Abstract: This paper presents a novel 3-dimensional coordinate transformed layer model (3D CTLM) for iron-core axial-flux permanent magnet synchronous motors (AFPMSMs). The proposed 3D CTLM initially ...
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