As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these ...

The objective of the 3D-SCALO problem is to assign the given components to optimal mounting surfaces and position them at the best locations, while satisfying the requirements for (1) heat dissipation ...

The right tool for the job makes all the difference. Ever try hammering a nail in with a rock? How many nails did you ruin before you gave up? Or try to tighten a crucial bolt by hand? It takes ...