The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...
COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback