Heterogeneous integration and system-level integration seen as 'next step' in advanced packaging era
With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing. Save my User ID and ...
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September 9, 2025. Co-chaired ...
A new technical paper titled “Harnessing Heterogeneity for Targeted Attacks on 3-D ICs” was published by Drexel University. “As 3-D integrated circuits (ICs) increasingly pervade the microelectronics ...
A new technical paper titled “On-Chip Batteries as Distributed Energy Sources in Heterogeneous 2.5D/3D Integrated Circuits” was published by researchers at University of Florida (Gainesville) and ...
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