TAIPEI (Taiwan News) — Asus said Friday it has no plans to invest in DRAM manufacturing, dismissing speculation triggered by ...

The MarketWatch News Department was not involved in the creation of this content. TAICHUNG, Taiwan, Dec. 11, 2025 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of ...

Applied Materials AMAT is seeing improving conditions in the Dynamic Random Access Memory (DRAM) market, which could support ...

ASUS is rumoured to enter the DRAM market next year, a move that could help address global memory shortages and impact prices ...

Micron Technology, Inc., has announced production sampling of its new 1Gb DDR2 device fabricated on 68-nanometer (nm) DRAM process technology. The new process, coupled with Micron’s 6F² technology, ...

Samsung has revealed that it has created the world’s first 24GB GDDR7 DRAM memory chip, which is designed for high-performance GPUs (graphics processing units). This new memory chip is not only the ...

Winbond Electronics has kicked off mass production of specialty DRAM memory using 20nm process technology, with plans to transition to a newer 16nm process, according to the Taiwan-based chipmaker.

HBM (High Bandwidth Memory) refers to a stack of multiple DRAM chips vertically arranged, which considerably amplifies data processing speeds. The evolution of HBM DRAM has seen its advancements from ...

TAICHUNG, Taiwan, Dec. 11, 2025 /PRNewswire/ -- Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the release of its new 8Gb DDR4 DRAM, ...